NVIDIA GB200
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Cooling Channel Design Optimization for High Power Multi-Chip Packages
arXiv:2605.20657v2 Announce Type: replace Abstract: Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based computational framework is developed to optimize embedded cooling channel layouts for high-power multi-chip modules. The model couples steady-state heat conduction with a porous media-based representation of coolant...