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Related Articles from SNS
Low Distortion Fusion Bonding using Pneumatically Warped Wafers
Announce Type: new Abstract: Backside power-delivery-network (BSPDN) schemes require wafer-to-wafer bonding steps that do not leave high order shape changes or localized stresses in the bonded stack to ensure that these don't get transferred to the thinned wafer for further lithographic exposure. However, bonding mechanics involve strong adhesive forces which can inherently create localized distortions that lithography tools must eventually compensate.