University of Illinois Grainger College of Engineering
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New 3D silicon chip breakthrough could extend Moore’s Law for years
New 3D silicon chip breakthrough could extend Moore’s Law for years - Date: - May 30, 2026 - Source: - University of Illinois Grainger College of Engineering - Summary: - As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the...
Out-of-plane ice bridges reveal new way to suppress frost spreading
Out-of-plane ice bridges reveal new way to suppress frost spreading Sadie Harley Scientific Editor Robert Egan Associate Editor A research team led by Professor Nenad Miljkovic in The Grainger College of Engineering at the University of Illinois Urbana-Champaign has published a breakthrough study in Nature Physics. The work reports the first experimental discovery of a previously unknown frost propagation mechanism—a "suspended ice bridge"—offering new pathways for anti-frosting surface...